Description
BIWIN Black Opal X570 GEN5 (1TB)
Biwin X570 PCIe Gen5x4 NVMe 2.0 SSD
The Biwin Black Opal X570 PCIe Gen5x4 NVMe 2.0 SSD delivers impressive sequential read/write speeds up to 14500 MB/s and 11000 MB/s. Built with premium 3D TLC NAND, it handles demanding tasks with ease, whether for gaming, video editing, or AI model training. With advanced thermal management, the X570 ensures a stable performance even under heavy workloads. With up to 2400 TBW and a 5-year limited warranty, the Biwin X570 offers optimized endurance with proven reliability.
Unlock the Cutting-Edge Speeds of Gen5
Taking full advantage of PCIe Gen5x4 and NVMe 2.0, the Biwin X570 achieves ultra-fast read speeds up to 14500 MB/s—approaching the maximum limit of PCIe 5.0. Equipped with premium 3D TLC NAND, it ensures peak performance even under intense workloads. From loading massive AAA games, transferring 4K/8K footage, or accelerating AI model training, the Biwin X570 turns heavy workloads into smooth operations.
Data Access Acceleration with HMB & SLC Cache
The Biwin X570 uses Host Memory Buffer (HMB) and intelligent SLC cache to speed up response times. HMB allows the SSD to use the host´s DRAM to improve I/O performance, while dynamic SLC cache intelligently reallocates cache blocks, optimizing SSD efficiency and extending its lifespan. This caching architecture enables faster, more stable, and improved responsive operations within an optimized DRAM-less design.
Effective Heat Management for Sustained Performance
Efficient thermal management ensures consistent performance under sustained workloads. Biwin X570 integrates a temperature control algorithm and thermal graphene pad to improve heat dissipation efficiency. Supported by Thermal Throttling and Power Management, the drive maintains optimal operating conditions during prolonged high-speed data transfer, multi-tasking, and gaming scenarios, ensuring reliable performance during even the most intensive usage cycles.
Single-Sided Design, Compatible with Many Devices
The Biwin X570 features a single-sided, DRAM-less design supported by advanced packaging technology that enables a slimmer profile, lower power consumption and more efficient heat dissipation. Compatible with PCIe 4.0 and PCIe 3.0*, the drive fits seamlessly into a wide range of devices and platforms. It’s ideal for flexible upgrades in today´s systems.
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